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 MEMS MEASUREMENT LAB

 

MEMS FABRICATION LAB

  RAPIDX 250 LASER MICROMACHINING

Features

Capability

Application

1.Use an excimer laser (KrF, wavelength = 248nm)

1. Directly fabricate the structures in a single   step, drastically reducing prototype time.

 
1.Microfluidics
 2. Stage assembly includes a porous ceramic vacuum chuck (50mm x 50mm)

2. Fabricate structure in a rapid prototype fashion with tolerances approaching 1 micron

 2. MEMS
 

3. Can process and pattern on Glass, Organic, Polymer and Silicon materials

3. Medical devices

 

4. Able to micro fabricate 2-D (flat sheets, tubes) and 3-D parts (balloons, non-planar surfaces) including XYZ, theta and goniometer

 

 

5. System operation are simple and can be operated by an individual with minimal technical ability

 

 

6. Do not use a thermal laser beam. Machines used for similar functions often use thermal lasers to perform their tasks, a process that lacks in precision & is not useable for heat-sensitive materials.

 

 

    

    MOLECULAR VAPOUR DEPOSITION (MVD)

 

Features

Capability

Application

1. MVD is a unique method for the vapour deposition of functionalized organic molecules that are used for modifying surfaces properties.

1.Can control surface energy
üAnti-stiction
üHydrophobic/ hydrophilic
üOleophobic/ Oleophilic
üLubrication
üBio-functional layer

1.MEMS

2. Large chamber size

2. To make protection layer

üMoisture barrier
üCorrosion barrier
üChemical barrier
üGas/ Oxygen barrier

2. Semiconductor

 

3. Good adhesion

üAdhesion promotion
üImproved thermal stability
üImproved Mechanical
üDurability

3. Biomedical & Microfluidics

 

4. Can make dielectric Films

üElectrical insulation
üLow temperature deposition
üConformal films on high A/R

4. Advanced packaging

 

 

 

SPTS UETCH HF RELEASE ETCHING

Features

Capability

Application

1. Use anhydrous HF vapour and ethanol

1. SPTS Vapor HF etches sacrificial SiO2 and other films using a vapor based etch in MEMS (Dry vapor phase process)

1.Microfluidics

2. The tool can accept 4”, 6” and 8” wafers, as well as dies on a carrier wafer

2. Vapor phase etching significantly decreases the presences of water on the wafer which highly.

2. MEMS

3. Large process window

3. Processes are available for etch rates of 110 Å/min to 2500 Å/min.

3. Medical devices

 

4. Eliminates stiction - repeatable, controlled, low cost process

 
 

5. Compatible with many metals/typical MEMS materials (Al)

 
 

6. Reduced pressure, elevated temperature

 

 

 

 

PLASMA ENHANCE CHEMICAL VAPOUR DEPOSITION (PECVD)

 

Features

Capability

Application

1. A fabrication method for depositing thin films on a water.

1. Lower temperature processes compared to conventional CVD

1.IC

2. In this method of CVD, plasma is added in the deposition chamber with reactive gases to create the desired solid surface on the substrate.

2. Film stress can be controlled by high/ low frequency mixing techniques

2. LED device

 

3. Dry plasma cleaning process with end-point control removes or reduces need for physical/ chemical chamber cleaning

3. MEMS

 

4. Control over stoichiometry via process conditions

4. Advanced packaging

 

5. Higher density, good adhesion, coverage & uniformity

 
 

6. Offers a wide range of material deposition, including:

üSiOx,SiNx and SiOxNy deposition for a wide range of application, hard mask, etc.
üAmorphous silicon (a-Si:H)
üTEOS SiO2 with conformal step coverage or void-free good step coverage
üSilicon carbide (SiC)
 

 

 

 

ELECTRON BEAM EVAPORATOR

 

Features

Capability

Application

1. High precision Electron Beam Evaporator system is a batch production equipment dedicated to the lift-off & conformal process with precision line-width requirement.

1.A form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charge tungsten filament under high vacuum.
üThe electron beam causes atoms from the target to transform into the gaseous phase.
üThese atoms then precipitate into solid form, coating everything in the vacuum chamber within line of sight with a thin layer of the anode material.

1. IC

2. 7cc X 4 pocket Crucible 3. Substrate Size: 8inch wafer, 4inch, 1cm by 1cm Piece Substrate Holder [3 type holder]

2. Multiple layers can easily be formed without releasing the vacuum.

2. LED device

 

3. The film can be made very thick or thin and thickness is easily contrlled.

3. MEMS

 

4. Can easilly deposit a wide range of materials.Eg:

üPlatinum
üAurum (Gold)
üAluminum
üTitanium
üMetal oxide ie AI203, ZnO, SiO2
 

 

 

MEASUREMENT TOOLS

  1. Spectroscopic Ellipsometer

                   

 

       2.  Electrodynamic Vibration System

                   

 

       3.  High Power Microscope

                  

 

      4.  Stylus Profiler

                 

OTHER FACILITIES

1. Wetbench for chemical preparation and spin dry

2. Fume Hood

3. Hotplate and stirrer

4. Spin coater

5. DI Water system

6. Furnace

7. Mixed Signal Oscilloscope

8. Digit Multimeter

9. Electrometer / High Resistance Meter

 

LIST OF MEMS RESEARCH

No

Project Title

1

Development of Piezoresistive Accelerometer MEMS Sensor for Human Movement Analysis

2

Development of Piezoelectric MEMS Pressure Sensor for Human Movement Analysis

3

Laser Micromachine Characterization

4

Optimization Of The MEMS Vibration Energy Harvester Cantilever Structure For Wireless Sensor Application

5

A Design of Sound Wave Harvester Circuit for Low DC Voltage Supply

6

Fabrication of Arrayed Microneedle using Laser Micromachine Process

7

Fabrication of Arrayed Microcantilever using Laser Micromachine Process

8

Low temperature deposition of Si3N4 using plasma enhanced chemical vapor deposition (PECVD)

9

Setting of advance anhydrous HF gas-phase etching in difference temperature

10

Setting of advance anhydrous HF gas-phase etching in difference pressure

11

Thin film of Pt coatings using Electron Beam Evaporator

12

Physical deformation in the laser-machined sites on PDMS

13

Physical deformation in the laser-machined sites on SU-8 photoresist

14

Physical deformation in the laser-machined sites on Teflon

15

A microfabricated rotary pump using laser micromachining

16

Surface  properties modification using molecular vapour deposition for biosensor application

17

Amorphous silicon carbide thin films deposited by plasma enhanced chemical vapor deposition (PECVD) at different temperature for harsh environment applications

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Advanced Multidisciplinary MEMS-Based Integrated Electronic NCER Centre of Excellence (AMBIENCE)
School of Microelectronic Engineering,
Universiti Malaysia Perlis (UniMAP),
SME Bank Industrial Estate, 02000 Kuala Perlis,
Perlis.

Tel: +604-9854724