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1. Technology Training:

  • Introduction to MEMS (3 days)
  • Practical MEMS Modeling (3 days)
  • MEMS structural fast prototyping (3 days)
  • MEMS release technology (3 days)
  • Hands on MEMS Fabrication (5 days)

 

2. Process Technology Training:

  • Hands on Laser Micromachining MEMS Fabrication by Using RapidX 250 (2 days)
  • Hands on Rapid Fabrication of Micro Cantilever Structures by Using RapidX 250 (2 days)
  • Hands on Piezoelectric Layer Deposition for MEMS by Using Electron Beam Evaporator  (2 days)
  • Hands on Silicon Anti-stiction MEMS Release Process by Using SPTS Uetch (2 days)
  • Hands on Advanced Layer Deposition for MEMS Using Molecular Vapour Deposition (MVD)  >2 days
  • Hands on Advanced Hydrophobic Nano Layer Deposition for MEMS applications by Using Molecular Vapour Deposition (MVD) >2 days                                        

 

3. PRISE Module:

  • The History and Future of Semiconductor Industry (3 days)
  • Introduction to Microelectronic Devices (3 days)

 

4.  Fast Track Module:

  •  Overview of IC Design, Simulation & Layout (2 days)
  •  Introduction to MEMS (2 days)

 

5. SNUCOE Module:

  • Introduction to MSC &PhD, Forms, Sponsorship, Titles of Research (1 day)
  • MEMS Micromachining Technology (2 days)
  • Essential Electrical And Mechanical Concept (2 days)
  • Piezoresistive Sensors (2 days)
  • Electrostatic Sensing And Actuation (2 days)
  • Thermal Sensing (2 days)
  • MEMS Device Application (2 days)
  • Physic In NEMS (2 days)
  • MEMS Fab: Principle/ Tech (2 days)
  • MEMS Packaging (2 days)
  • Lab On A Chip & Device (2 days)

 

6.  Innovate Malaysia (MEMS Track) >2 days

 

7.  Training on  FPGA  DE2-115 Board  (2 Days)

 

8. Tessde Modul

  • Communication Skills (Presentation Skills, Report Writing, Negotiation Skills, etc)     (2 days)
  • The History And Future Of Semiconductor Industry     (1 day)
  • Semiconductor Material Properties And Devices     (3 days)
  • Project Management     (2 days)
  • Clean Room Technologies And Practices     (1day) 
  • CMOS Device Modelling And Circuit     (3 days)
  • VLSI Layout Design Techniques     (3 days)
  • Overview Of IC Design For Semiconductor Foundries     (4days) 
  • Wafer Test And Yield Analysis     (2 days)
  • Fundamental Of IC Package Technology And Design     (3 days) 
  • English communication     (2 days)
  • Project Teamwork, Professional/Ethical Engineers, Wholesome Life - Engineering Ethics     (2 days)
  • Introduction To MEMS     (2 days) 
  • Process Simulation & Wafer FAB Process(CMP, DIF, ETC, IMP, PHT, & TFM)     (2days) 
  • Metrology Technology     2 days
  • 8D Method of Problem Solving     (2 days)
  • Semiconductor Device Processing And Manufacturing     (5 days)
  • Critical thinking and Creative thinking     (2 days)
  • Failure Modes & Mechanisms Due To Wafer Properties And Processes     (3 days)
  • Semiconductor Crystal Growth And Substrate Preparation     (2 days)
  • Bi-Polar C-MOS -DMOS (BCD Process)     (3 days)
  • Manufacturing Excellence     (2 days)
  •  Technical Report Writing     (2  days)

 

9. NCITE  Module: Introduction to fabrication for IC Designs

 

 

 

 

 

 

    

 

 

 

 

 

DASAR PRIVASI

POLISI KESELAMATAN

PENAFIAN

HAKCIPTA

Advanced Multidisciplinary MEMS-Based Integrated Electronic NCER Centre of Excellence (AMBIENCE) School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP), SME Bank Industrial Estate, 02000 Kuala Perlis, Perlis.

Tel: +604-9854724