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Temp files



Electron Beam evaporator

The electron beam causes atoms from the target to transform into the gaseous phase.

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Plasma Enhance Chemical Vapour Deposition (PECVD)

Lower temperature processes compared to conventional CVD

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SPTS UETCH HF Release Etching

Reduced pressure, elevated temperature

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Molecular Vapour Deposition (MVD)

MVD is a unique method for the vapour deposition of functionalized organic molecules that are used for modifying surfaces properties

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PROCESS

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Sell microcantilever (Si Substrate)
*Price is open for negotiation
  
 Array microcantilever sample
 
 cantilever 1 : width ~ 40 um
                                             
cantilever 3 : width ~ 20 um
 
 

ADVANCED HYDROPHOBIC NANOLAYER FOR MEMS APPLICATION

~ Service Price RM 200/hour

 

 

sample

Handphone only

 

Handphone + MVD

 

Hydrophobic Nano Layer

 

ADVANTAGE

 

  1.  Low thermal damage (low temperature process)
  2. Process control through automation
  3. Excellent production  repeatability
  4.  Demonstrated large yield increase
  5. Demonstrated product enablement
  6. Safe operation
  7. Applicable to many materials
  8. High precision
  9.  Low cost
  10.  Only 2 MVD machines in Malaysia

 

MEMS STRUCTURE REALIZATION USING KRF EXCIMER LASER MICROMACHINING

~ Service Price RM 0.01/firing

 

 

sample:

  

Piezoresistor mask & fabrication structured by micromachining

  

ADVANTAGES

  1.  Appropriate cost
  2. Can design a micro size in short period of time
  3.   Environmental friendly
  4.  Less chemical usage especially in etching process
  5. Reduce the number of mask involves
  6. Applicable to many materials
  7.  Highly flexible CNC programming  
  8.  High precision (tolerance ± 1um)
  9.  Low thermal damage

 

 

APPLICATION OF ADVANCED ANHYDROUS HF BASED SACRIFICIAL SIO2 REMOVAL TOWARDS ANTI-STICTION MEMS REALIZATION

~ Service Price RM 200/hour

 

sample

Sample 1:   Etch/Remove oxide layer on silicon wafer

ADVANTAGE

  1. Know how to optimize Silterra HF vapor release process recipe.
  2. Realization of MEMS structure on Silterra CMOS substrate
  3. Can etch sacrificial SiO2 and other films
  4. Eliminates stiction – dry vapour process, repeatable, controlled
  5. Reduce pressure & elevated pressure
  6. Fast process & low cost
  7. Compatible with many metals/typical MEMS materials (Al)
  8. The graduate intern can be absorbed as the worker of the collaborating organization
  9. Recognition to the academician

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

R&D PRODUCT

 

Automated Silicon Wet Etch System   

 

       

 

 

   Agriculture Surveillance Hydroponic Paddy

 

 

 

    Ultra Low Cost Automotive Passenger Safety system Trainer  

 

 

 

The Shoe Insole Using FPGA Implementation

             

      

 MEMS Pressure Sensor 

 

 

Cantilever for Energy Harvesting

 

                                                                            

  Wireless Shoe In-sole System for   Biomedical and Biometric applications 

 

 

Microcantilever produced by laser micromachine tool

 

                                       

                    

 Piezoresistive Accelerometer MEMS Sensor 

   

 

 

Glass-based Microcantilever Formation By Laser Micromachining

            

                                   

       

  Array Microcantilever (top and back side of the samples) 

            

                                  

 

 

Intelligent Wireless Tire Pressure Monitoring System (TPMS) 

     

 

 

 Halalan Toiyiban Chicken Cleaning for Poultry Processing  

 

 

Halalan Toiyiban Basket Cleaning for Poultry Processing   

 

                           

 

      Automated Bird, Rat, and Pig Repellent System 

          

                  

 

Piezoresistive Accelerometer Sensor

 

Piezoresistor Mask & Fabrication Structured by Micromaching 

 

 

Design of Compact Low Pass Filter In Microstrip / MEMS Technology

 

 

 

Piezoresistor model

 

 

 

Microchannel

 

 

 

  SAMPLE : RapidX 250 Laser Micromachining

  - Fabricate microcantilever

              

              

                                   contilever 1                                                 contilever 2

 

 

 

 SAMPLE : RapidX 250 Laser Micromachining

 - Fabricate microcantilever

                

                  cantilever 1 : width ~ 40um                                    cantilever 2 : width ~ 40um

    cantilever 3 : width ~ 20um

 

 

 

 SAMPLE : Molecular Vapour Deposition (MVD)

 -Deposit hydrophobic layer on silicon wafer

                  

 SAMPLE : Rectangular arrayed Microcantilever

 

NO

LENGTH

(μm)

WIDTH

(μm)

GAP (μm)

1

998.63

144.53

512.33

2

845.21

93.84

513.70

3

698.63

71.92

512.33

4

546.58

47.95

512.33

 

 

 SAMPLE : Triangular arrayed Microcantilever

 

NO

LENGTH

(μm)

WIDTH

(μm)

GAP (μm)

1

998.63

142.47

498.63

2

846.58

89.73

500.00

3

701.37

65.75

500.00

4

550.68

46.27

500.00

 SAMPLE : Double-Legged arrayed Microcantilever

 

NO

LENGTH

(μm)

WIDTH

(μm)

GAP (μm)

1

997.26

144.53

505.48

2

849.32

94.52

502.74

3

697.26

71.92

502.74

4

546.58

45.21

502.74

 

 

 

 

 

 

 

 

COLLABORATION PROGRAMME

 

1.  Northern Corridor Implementation Authority (NCIA) 

NCIA as the authority responsible for providing direction and for devising policies and strategies in relation to socio-economic development in the Northern Corridor Economic Region (Koridor Utara), which encompasses 21 districts in northern Peninsular Malaysia.

  • SNUCOE grants: NCIA awarded SNUCOE & N-SILICON grants to develop new COE (AMBIENCE) through collaboration with Silterra Malaysia Sdn Bhd & UniMAP                        
  •   N-SILICON grant
  • LED: new UniMAP programme 
  • MEMS Fabrication Laboratory

 

2.  Silterra Malaysia Sdn. Bhd

A leading wafer foundry provider, offers state-of-the-art CMOS wafer technology to global semiconductor customers.

  • SNUCOE & N-SILICON grants
  • INNOVATE MALAYSIA
  • FAST TRACK

           *In 2014, already trained 100 engineers by using AMBIENCE’s facility

    

3.  Altera Corporation (M) Sdn. Bhd

The pioneer of programmable logic solutions, enabling system & semiconductor companies to rapidly and cost effectively innovate, differentiate and win in their markets.

  • Grant & contribution for MEMS Fabrication Laboratory & FPGA boards
  • Train 200 students every year. In 2014, already trained 200 students

 

 

4.  Kulim Technology Park Corporation Sdn Bhd (KTPC)

KTPC has been entrusted with the development and management of Kulim Hi-Tech, a national project established by the government of Malaysia to spearhead the country’s trust towards high value added industrialization and R&D activities.

  • Technology partner
  • PRISE programme: In 2011 & 2012, already trained 50 students (UniMAP & USM)

 

 

5.  IR Sensors & Systems

New company that involve in designs, manufactures and sells MEMS based products. The company' produces microphones & disposable blood pressure sensors.

  • Technology sharing 

   

 

6. IKBN PERLIS

IKBN and AMBIENCE work collaboratively to design and develop a reusable airbag deployment system using MEMS technology in combination to Altera Corps. Reconfigurable FPGA platform.

 

 

7. HAJAR HIJRAH SDN. BHD.

Hajar Hijrah Sdn Bhd is one of the pioneers in Halalan Toiyiban industry in the northern region and is looking for ways to automate the Halalan Toiyiban processing that they pioneered. It is accepted that the automation will enable Hajar Hijrah to cope with the sudden income in the demand for Halalan Toiyiban chicken

 

1)      Proposed Solution: Design & Prototype of Automatic Chicken Neck Cleaner

 

2)      Proposed Solution: Design & Prototype of Automatic Basket Cleaner

 

3)      Proposed Solution: Design & Prototype of Automatic Slaughtering Knife Cleaner

 

 

 

8. KOPERASI AGRO BELANTIK 

 

It is therefore a due need for development of a unique automated system for monitoring and controlling of irrigation and pest attack for the sustainability of the economically critical unique paddy farming activity of the Sik population.

 

1)        Proposed Solution: Design of Automatic System For Monitoring And Controlling of Irrigation

 

2)        Proposed Solution: Design & Prototype of Automated Bird Repellent System

 

 

9 CENE, PRINCE of SONGKLA UNIVERSITY (PSU), THAILAND

Collaboration programme where AMBIENCE will help CENE to do some research  & fabrication process on their samples. Eg: research about power bank IC design.

  

 

 

 

1. UniMAP Invention Exhibition 2014

2. ITEX 2014

3. Gold Medal At AYIE 2014

4. Gold Medal And Vice Chancellor Award At I-ENVEX 2014

5. Industry Training 2012

6. Best Of The Best Invention, IYIA 2014, Jakarta

7. UniMAP Invention EXPO 2015

8. ITEX EXPO 2015, KLCC (Piezoresistive Accelerometer MEMS Sensor Formation by Laser Micromachining - Silver Medal)

9. Innovate Malaysia (Altera Track) 2015 (Shoe Insole Using FPGA Implementation - TOP 5 National Grand Finale Award)

10. IRIA EXPO 2015, UUM Kedah (Gait Based Biometrics Identification For Security Application - Bronze Medal) 

             

                    

11. Two Gold medals at UniMAP EREKA 2016:  MEMS Structure Realization Using KrF Laser Micromachining & Micro Fabrication Of MEMS Structure Using Advanced Anti -Stiction HF Release Process

12. Six Silver medals at UniMAP EREKA 2016

13. 27/01/2016 Participated in UniMAP EREKA 2016 at UniMAP, Pauh. AMBIENCE won 2 gold Medals & 6 silver Medals. Gold medals for title of MEMS Structure Realization using KrF Laser Micromachining & Micro Fabrication of MEMS Structure using Advanced Anti-Stiction HF Release Process

                                 

                      

14. 12-14/05/2016 Participated in ITEX 2016 at KLCC. AMBIENCE won Gold Medal & special award from Asia Invention Association (AIA) for title of MEMS Structure Realization using KrF Laser Micromachining

                                       AWARDS 2012 -2016

                  

                                  

 

 

 

 

 

 

 

  

 

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Advanced Multidisciplinary MEMS-Based Integrated Electronic NCER Centre of Excellence (AMBIENCE)
School of Microelectronic Engineering,
Universiti Malaysia Perlis (UniMAP),
SME Bank Industrial Estate, 02000 Kuala Perlis,
Perlis.

Tel: +604-9854724 

 

 

           

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