Training Capabilities
1. Technology Training:
- Introduction to MEMS (3 days)
- Practical MEMS Modeling (3 days)
- MEMS structural fast prototyping (3 days)
- MEMS release technology (3 days)
- Hands on MEMS Fabrication (5 days)
2. Process Technology Training:
- Hands on Laser Micromachining MEMS Fabrication by Using RapidX 250 (2 days)
- Hands on Rapid Fabrication of Micro Cantilever Structures by Using RapidX 250 (2 days)
- Hands on Piezoelectric Layer Deposition for MEMS by Using Electron Beam Evaporator (2 days)
- Hands on Silicon Anti-stiction MEMS Release Process by Using SPTS Uetch (2 days)
- Hands on Advanced Layer Deposition for MEMS Using Molecular Vapour Deposition (MVD) >2 days
- Hands on Advanced Hydrophobic Nano Layer Deposition for MEMS applications by Using Molecular Vapour Deposition (MVD) >2 days
3. PRISE Module:
- The History and Future of Semiconductor Industry (3 days)
- Introduction to Microelectronic Devices (3 days)
4. Fast Track Module:
- Overview of IC Design, Simulation & Layout (2 days)
- Introduction to MEMS (2 days)
5. SNUCOE Module:
- Introduction to MSC &PhD, Forms, Sponsorship, Titles of Research (1 day)
- MEMS Micromachining Technology (2 days)
- Essential Electrical And Mechanical Concept (2 days)
- Piezoresistive Sensors (2 days)
- Electrostatic Sensing And Actuation (2 days)
- Thermal Sensing (2 days)
- MEMS Device Application (2 days)
- Physic In NEMS (2 days)
- MEMS Fab: Principle/ Tech (2 days)
- MEMS Packaging (2 days)
- Lab On A Chip & Device (2 days)
6. Innovate Malaysia (MEMS Track) >2 days
7. Training on FPGA DE2-115 Board (2 Days)
8. Tessde Modul
- Communication Skills (Presentation Skills, Report Writing, Negotiation Skills, etc) (2 days)
- The History And Future Of Semiconductor Industry (1 day)
- Semiconductor Material Properties And Devices (3 days)
- Project Management (2 days)
- Clean Room Technologies And Practices (1day)
- CMOS Device Modelling And Circuit (3 days)
- VLSI Layout Design Techniques (3 days)
- Overview Of IC Design For Semiconductor Foundries (4days)
- Wafer Test And Yield Analysis (2 days)
- Fundamental Of IC Package Technology And Design (3 days)
- English communication (2 days)
- Project Teamwork, Professional/Ethical Engineers, Wholesome Life - Engineering Ethics (2 days)
- Introduction To MEMS (2 days)
- Process Simulation & Wafer FAB Process(CMP, DIF, ETC, IMP, PHT, & TFM) (2days)
- Metrology Technology 2 days
- 8D Method of Problem Solving (2 days)
- Semiconductor Device Processing And Manufacturing (5 days)
- Critical thinking and Creative thinking (2 days)
- Failure Modes & Mechanisms Due To Wafer Properties And Processes (3 days)
- Semiconductor Crystal Growth And Substrate Preparation (2 days)
- Bi-Polar C-MOS -DMOS (BCD Process) (3 days)
- Manufacturing Excellence (2 days)
- Technical Report Writing (2 days)
9. NCITE Module: Introduction to fabrication for IC Designs