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Electron Beam evaporator

The electron beam causes atoms from the target to transform into the gaseous phase.

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Plasma Enhance Chemical Vapour Deposition (PECVD)

Lower temperature processes compared to conventional CVD

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SPTS UETCH HF Release Etching

Reduced pressure, elevated temperature

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Molecular Vapour Deposition (MVD)

MVD is a unique method for the vapour deposition of functionalized organic molecules that are used for modifying surfaces properties

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PROCESS

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Sell microcantilever (Si Substrate)
*Price is open for negotiation
  
 Array microcantilever sample
 
 cantilever 1 : width ~ 40 um
                                             
cantilever 3 : width ~ 20 um
 
 

ADVANCED HYDROPHOBIC NANOLAYER FOR MEMS APPLICATION

~ Service Price RM 200/hour

 

 

sample

Handphone only

 

Handphone + MVD

 

Hydrophobic Nano Layer

 

ADVANTAGE

 

  1.  Low thermal damage (low temperature process)
  2. Process control through automation
  3. Excellent production  repeatability
  4.  Demonstrated large yield increase
  5. Demonstrated product enablement
  6. Safe operation
  7. Applicable to many materials
  8. High precision
  9.  Low cost
  10.  Only 2 MVD machines in Malaysia

 

MEMS STRUCTURE REALIZATION USING KRF EXCIMER LASER MICROMACHINING

~ Service Price RM 0.01/firing

 

 

sample:

  

Piezoresistor mask & fabrication structured by micromachining

  

ADVANTAGES

  1.  Appropriate cost
  2. Can design a micro size in short period of time
  3.   Environmental friendly
  4.  Less chemical usage especially in etching process
  5. Reduce the number of mask involves
  6. Applicable to many materials
  7.  Highly flexible CNC programming  
  8.  High precision (tolerance ± 1um)
  9.  Low thermal damage

 

 

APPLICATION OF ADVANCED ANHYDROUS HF BASED SACRIFICIAL SIO2 REMOVAL TOWARDS ANTI-STICTION MEMS REALIZATION

~ Service Price RM 200/hour

 

sample

Sample 1:   Etch/Remove oxide layer on silicon wafer

ADVANTAGE

  1. Know how to optimize Silterra HF vapor release process recipe.
  2. Realization of MEMS structure on Silterra CMOS substrate
  3. Can etch sacrificial SiO2 and other films
  4. Eliminates stiction – dry vapour process, repeatable, controlled
  5. Reduce pressure & elevated pressure
  6. Fast process & low cost
  7. Compatible with many metals/typical MEMS materials (Al)
  8. The graduate intern can be absorbed as the worker of the collaborating organization
  9. Recognition to the academician

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DASAR PRIVASI

POLISI KESELAMATAN

PENAFIAN

HAKCIPTA

Advanced Multidisciplinary MEMS-Based Integrated Electronic NCER Centre of Excellence (AMBIENCE) School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP), SME Bank Industrial Estate, 02000 Kuala Perlis, Perlis.

Tel: +604-9854724 

 

 

           

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